The process of Low Pressure Molding (LPM) technology commences by heating thermoplastic Polyamide materials, often referred to as "hot melts," until they transform into a liquid state. These liquefied molding materials can then take the shape of the mold they are placed in, effectively encapsulating delicate electrical components. Subsequently, the material is allowed to cool and solidify into the desired shape. The primary distinguishing feature of Polyamide materials lies in their ability to liquefy at low temperatures and be injected with minimal pressure. This technology facilitates the encapsulation process without causing harm to the sensitive electronic parts it aims to protect from natural elements such as dust, dirt, moisture, and vibration. Initially developed in Europe, Low Pressure Molding (LPM) was primarily utilized for sealing connectors and providing wire strain relief.
The market size of Low Pressure Molding (LPM) using Polyamides exhibited considerable strength in 2020 and is projected to maintain a steady revenue growth rate in the coming years. Key drivers of this market growth include the capability of over-molding, like LPM, for components unsuitable for high-pressure typical injection molding. Another advantage of LPM compared to traditional injection molding processes is its lower cost and faster start-up time. LPM procedures employ cost-effective Aluminum mold designs and basic equipment that can be swiftly constructed and seamlessly integrated into the production process. In contrast, conventional injection molding is more expensive and involves longer start-up periods than LPM. Consequently, the Low Pressure Molding (LPM) using Polyamides Market is expected to expand further.
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Major Companies Profiled in The Report:
- Henkel
- Bostik
- MoldMan
- SUNTIP
- Austromelt
- Rixin Fine Synthetic Material
- Taiyu Alwayseal Technology
- KY Chemical
Advantages Of Low Pressure Molding (LPM) with Polyamides Market
1. Gentle Encapsulation Process: LPM gently encapsulates sensitive electronic components without causing damage, safeguarding them from environmental factors like dust, moisture, and vibrations.
2. Low-Temperature Liquefaction: The capability of Polyamide materials to liquefy at low temperatures enables the molding process with minimal pressure, preserving the integrity of delicate electronic parts.
3. Adaptability for Delicate Components: It's ideal for components that can't endure the high pressure of traditional injection molding, allowing for the encapsulation of more delicate parts.
4. Cost Efficiency: LPM offers lower costs compared to conventional injection molding due to inexpensive Aluminum mold designs and simpler equipment, reducing production expenses.
5. Faster Start-Up: With basic and quick-to-implement equipment, LPM has a shorter start-up time compared to traditional methods, enhancing production efficiency.
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Detailed Segmentation in Our Report:
For the purpose of this report, the Global Low Pressure Molding (LPM) with Polyamides Market is segmented on the basis of product type, application type, and region:
Product Type Outlook (Revenue, USD Billion; 2018-2028)
- Black Type
- Amber Type
- Others
Application Type Outlook (Revenue, USD Billion; 2018-2028)
- Electronics
- Automotive
- Textile Industry
- Others
Region Outlook (Revenue, USD Billion; 2018-2028)
- North America
- U.S.
- Canada
- Mexico
- Europe
- Germany
- U.K.
- France
- Italy
- Spain
- Benelux
- Rest of Europe
- Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia Pacific
- Latin America
- Brazil
- Rest of Latin America
- Middle East & Africa
- Saudi Arabia
- UAE
- South Africa
- Rest of Middle East & Africa
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